Thermal silicone pad for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or bleed Non capacitive or electrically conductive Dimensions: 100 x 100 x 1 mm Net weight: 23 g Color: grey Thermal conductivity: 2.0 W/m-K Specific gravity: 1.7 +0.1 g/cm3 Hardness: 40 ± 5 Shore C Contin
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Popis
Thermal silicone pad for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Dimensions: 100 x 100 x 1 mm
Net weight: 23 g
Color: grey
Thermal conductivity: 2.0 W/m-K
Specific gravity: 1.7 +0.1 g/cm3
Hardness: 40 ± 5 Shore C
Contin
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Dimensions: 100 x 100 x 1 mm
Net weight: 23 g
Color: grey
Thermal conductivity: 2.0 W/m-K
Specific gravity: 1.7 +0.1 g/cm3
Hardness: 40 ± 5 Shore C
Contin
Parametry
| Výrobce | Gembird |
